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Koch Chemie

Koch Chemie Micro Cut Pad | Finishing polishing pad (45 mm)

  • Removes holograms, fine scratches, and polishing marks
  • Creates maximum gloss during the final step of paint correction
  • Milled edges easily adapt to the contours of the bodywork

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139,00 Kč

External warehouse (ships in 2-3 days) Zboží bude skladem a odesláno do 2–3 pracovních dnů. Podle vytíženosti dodavatele se doba může prodloužit až na 5 dnů.
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Finishing pad for hologram removal and maximum gloss

Koch-Chemie Micro Cut Pad is a high-quality special foam pad designed to remove fine scratches, holograms, and polishing marks. It is ideally suited for use with Micro Cut M3.02 and Micro Cut & Finish P3.01 polishing compounds, with which it achieves a high-gloss finish.

The low height of the pad (23 mm) minimizes torsional forces, which ensures excellent handling and maximum stability during polishing. The special density of the foam material allows for long-term resistance to compression, thereby maintaining its properties even during prolonged use.

The open-cell structure ensures uniform dispersion of the compound and a high-gloss finish. Thanks to the milled edges, the pad easily adapts to the bodywork's contours and allows for uniform polishing even in hard-to-reach areas.

Product advantages

  • Ideal for final polishing and hologram removal.
  • Perfect combination of fine abrasiveness and high gloss.
  • Special foam structure ensures long service life and shape retention.
  • Open-cell structure for maximum gloss.
  • Milled edges for better adaptation to vehicle contours.
  • Excellent stability and easy handling thanks to the 23 mm height.

Technical parameters

  • Compression hardness: 10/20.
  • Abrasiveness: 5/10.

Areas of application

  • Final polishing of painted surfaces on passenger and commercial vehicles.
  • Removal of fine scratches, holograms, and polishing marks to a high-gloss finish.
  • Use with Micro Cut M3.02 and Micro Cut & Finish P3.01 compounds.

Recommended use

  1. Use the pad with Micro Cut M3.02 for the best finish.
  2. Attach the pad to the polishing machine and apply the compound evenly.
  3. Work at medium speeds with moderate pressure and move in a cross-hatch pattern.
  4. After polishing, clean the pad thoroughly and let it dry.

Safety information

  • Do not use on hot surfaces.
  • After use, clean and allow to dry thoroughly.

Frequently asked questions

Which compound should the Micro Cut Pad be combined with? With the fine finishing compound Micro Cut M3.02 or Micro Cut & Finish P3.01 – the pad is designed specifically for final polishing.

What speed and pressure should be used? Work at medium speeds with moderate pressure in cross-hatch motions to avoid overheating the paint.

How should the pad be cared for after use? Clean it thoroughly and let it air dry so it retains optimal properties for further polishing.

When should one use this smaller 45 mm size? The smaller pad is suitable for detailed work in complex areas and small surfaces where a larger pad will not fit.

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