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Koch Chemie

Koch Chemie Micro Cut Pad | Finishing polishing pad (76 mm)

  • Removes holograms, fine scratches, and polishing marks
  • Creates maximum gloss during the final step of paint correction
  • Milled edges easily adapt to the contours of the bodywork

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179,00 Kč

External warehouse (ships in 2-3 days) Zboží bude skladem a odesláno do 2–3 pracovních dnů. Podle vytíženosti dodavatele se doba může prodloužit až na 5 dnů.
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Finishing pad for hologram removal and maximum gloss

The Koch-Chemie Micro Cut Pad is a high-quality specialty foam pad designed to remove fine scratches, holograms, and polishing marks. It is ideally suited for use with Micro Cut M3.02 and Micro Cut & Finish P3.01 polishing compounds, with which it achieves a high-gloss finish.

The low profile (23 mm) minimizes torsional forces, ensuring excellent handling and maximum stability during polishing. The special density of the foam material provides long-term resistance to compression, maintaining its properties even during prolonged use.

The open-cell structure ensures even distribution of the compound and a high level of gloss. Thanks to its milled edges, the pad easily adapts to body contours and allows for uniform polishing even in hard-to-reach areas.

Product Benefits

  • Ideal for final polishing and hologram removal.
  • Perfect combination of fine abrasivity and high gloss.
  • Special foam structure ensures long service life and shape retention.
  • Open-cell structure for maximum gloss.
  • Milled edges for better adaptation to vehicle contours.
  • Excellent stability and easy handling thanks to the 23 mm height.

Technical Parameters

  • Compression hardness: 10/20.
  • Abrasivity: 5/10.

Areas of Application

  • Final polishing of painted surfaces on passenger cars and commercial vehicles.
  • Removal of fine scratches, holograms, and polishing marks to a high gloss.
  • Use with Micro Cut M3.02 and Micro Cut & Finish P3.01 compounds.

Recommended Use

  1. Use the pad with Micro Cut M3.02 for the best finish.
  2. Attach the pad to the polisher and apply the compound evenly.
  3. Work at medium speed with light pressure, moving in a cross-hatch pattern.
  4. After polishing, thoroughly clean the pad and let it dry.

Safety Information

  • Do not use on hot surfaces.
  • Clean after use and allow to dry thoroughly.

Frequently Asked Questions

Which compound should the Micro Cut Pad be combined with? With the fine finishing compounds Micro Cut M3.02 or Micro Cut & Finish P3.01 – the pad is designed specifically for final polishing.

What speed and pressure should I work at? Work at medium speed with light pressure in cross-hatch motions to avoid overheating the paint.

How should the pad be cared for after use? Clean it thoroughly and let it air dry so it retains its optimal properties for the next polishing session.

When should I reach for this 76 mm size? It is suitable for medium-sized areas and more complex body details where a larger 125 mm pad will not fit.

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