Koch Chemie Micro Cut Pad | Finishing polishing pad (125 mm)

Finishing pad for hologram removal and maximum gloss

The Koch Chemie Micro Cut Pad is a high-quality special foam pad designed for the removal of fine scratches, holograms, and polishing marks. It is ideally suited for use with Micro Cut M3.02 and Micro Cut & Finish P3.01 polishing compounds, with which it achieves a high-gloss finish.

The low height of the pad (23 mm) minimizes torsional forces, which ensures excellent handling and maximum stability during polishing. The special density of the foam material allows for long-lasting resistance to compression, maintaining its properties even during prolonged use.

The open-cell structure ensures uniform paste distribution and a high-gloss finish. Thanks to the milled edges, the pad easily adapts to the shapes of the bodywork and allows for even polishing even in hard-to-reach areas.

Product advantages

• Ideal for final polishing and hologram removal.
• Perfect combination of fine abrasivity and high gloss.
• Special foam structure ensures long service life and shape retention.
• Open-cell structure for maximum gloss.
• Milled edges for better adaptation to vehicle contours.
• Excellent stability and simple handling thanks to the 23 mm height.

Technical parameters

• Compression hardness: 10/20.
• Abrasivity: 5/10.

Areas of application

• Final polishing of painted surfaces of passenger and commercial vehicles.
• Removal of fine scratches, holograms, and polishing marks to a high-gloss finish.
• Use with Micro Cut M3.02 and Micro Cut & Finish P3.01 compounds.

Recommended use

1. Use the pad with Micro Cut M3.02 for the best finish.
2. Attach the pad to the polisher and apply the compound evenly.
3. Work at medium speed with light pressure, moving in a cross pattern.
4. After polishing, clean the pad thoroughly and let it dry.

Safety information

• Do not use on hot surfaces.
• Clean after use and let dry thoroughly.

Frequently asked questions

Which compound should the Micro Cut Pad be combined with? With the fine finishing compound Micro Cut M3.02 or Micro Cut & Finish P3.01 – the pad is designed directly for final polishing.

What speed and pressure should be used? Work at medium speed with light pressure in cross-hatch motions to avoid overheating the paint.

How should the pad be cared for after use? Clean it thoroughly and let it air dry so it retains optimal properties for further polishing.

What is the difference compared to the One Cut Pad? The Micro Cut Pad is used for final polishing and hologram removal in combination with the fine M3.02 compound, while the One Cut Pad is intended for medium paint correction with the one-step P6.02 compound.