Koch Chemie MICRO CUT PAD

FOAM FINISHING POLISHING PAD FOR USE WITH AN ORBITAL POLISHER

The Micro Cut Pad is a high-quality special foam pad designed to remove fine scratches, holograms, and polishing marks. It is ideally suited for use with polishing compounds Micro Cut M3.02 and Micro Cut & Finish P3.01, with which it achieves a perfect high gloss.

The short height of the pad (23 mm) minimizes torsional forces, ensuring excellent handling and maximum stability during polishing. The special density of the foam material provides long-term resistance to compression, maintaining its properties even with extended use.

The open cell structure ensures perfect compound dispersion and a high gloss finish. Thanks to its milled edges, the pad easily adapts to body shapes, allowing for even polishing even in hard-to-reach areas.

PRODUCT ADVANTAGES

• Ideal for final polishing and hologram removal
• Perfect combination of gentle abrasiveness and high gloss
• Special foam structure ensures long life and shape stability
• Open cell structure for maximum gloss
• Milled edges for better adaptation to vehicle contours
• Excellent stability and easy handling thanks to 23 mm height

TECHNICAL PARAMETERS

• Compression Hardness: 10/20

• Abrasiveness: 5/10

AREAS OF USE

• Final polishing of painted surfaces of passenger and commercial vehicles
• Removal of fine scratches, holograms, and polishing marks for a luxurious shine
• Use with compounds Micro Cut M3.02 and Micro Cut & Finish P3.01

RECOMMENDED USE

1. Use the pad with Micro Cut M3.02 or for a perfect finish.
2. Attach the pad to the polisher and apply the compound evenly.
3. Work at medium speed with light pressure, moving in a crosshatch pattern.
4. After polishing, thoroughly clean the pad and let it dry.

SAFETY INFORMATION

• Do not use on hot surfaces.
• Clean after use and allow to dry thoroughly.